Job Description
Nexperia in Seremban, Malaysia is seeking a Senior Wire Bond Equipment & Process Engineer to optimize semiconductor manufacturing processes. This role involves leading the setup and qualification of wire bonding equipment, collaborating with R&D and manufacturing teams, and implementing process improvements.
The ideal candidate has a Bachelor's degree in engineering, at least 5 years of experience in wire bonding, and strong analytical skills. Nexperia values diversity and offers a dynamic work environment.
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Submit ApplicationJob Details
- Location seremban, negeri sembilan
- Job Type Full-time
- Category Engineering
- Posted Date June 23, 2026
- Application Deadline August 02, 2026