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Lead Solutions Engineer: SI/PI/Thermal Analysis

Cadence Design Systems, Inc.
📍 Belo Horizonte, State of Minas Gerais, Brazil 💼 Full time 🕒 Posted June 04, 2026
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Job Description

Description

:

  • Work in a team environment creating and implementing 3DIC reference flows and designs.

  • The candidate is expected to be anhave advanced knowledge of advanced packaging signal and power integrity analysis tools and flows. 

  • Use Sigrity, Clarity and Celcius and multiple 3DIC configurations to help customers with strong problem-solving skills.

  • Knowledge of the CMOS sign-off design flow a plus.

    • Requirements:

  • Complete Bachelor’s degree in Electrical or Electronics Engineering

  • Experience with package design and Cadence SI/PI/Thermal tools

  • Strong knowledge of advanced packaging concepts

  • Strong knowledge of 2.5D, 3DIC and stacked die technologies

  • Strong personal drive for continuous learning and expanding professional skill sets

  • Excellent verbal and written communication skills in English and Portuguese.

    Ready to Apply?

    Submit your application today and join our talented team at Cadence Design Systems, Inc..

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    • Job Details

    • Location Belo Horizonte, State of Minas Gerais
    • Job Type Full time
    • Category Computer Occupations
    • Posted Date June 04, 2026
    • Application Deadline July 14, 2026