Job Description
We have an opportunity to impact your career and provide an adventure where you can push the limits of what's possible.
As a Lead Software engineer at JPMorgan Chase within the Commercial and Investment bank, Payments Engineering & Architecture team, you're responsible for how 10,000 Payments engineers adopt architecture standards and AI-assisted development practices. You won't do this from a distance - you'll be embedded with teams, writing code, running gemba walks, presenting at tech talks, and writing blogs. Advocacy through action, not announcements. Payments moves $10 trillion every day for the world's leading companies - the engineering challenges are real, and so is the opportunity to shape how we build.
**Job responsibilities**
+ Embeds within Payments application teams as a contributing engineer, committing real changes to production codebases
+ Pairs with engineers to solve complex problems and model best practices in architecture, code quality, and ...
As a Lead Software engineer at JPMorgan Chase within the Commercial and Investment bank, Payments Engineering & Architecture team, you're responsible for how 10,000 Payments engineers adopt architecture standards and AI-assisted development practices. You won't do this from a distance - you'll be embedded with teams, writing code, running gemba walks, presenting at tech talks, and writing blogs. Advocacy through action, not announcements. Payments moves $10 trillion every day for the world's leading companies - the engineering challenges are real, and so is the opportunity to shape how we build.
**Job responsibilities**
+ Embeds within Payments application teams as a contributing engineer, committing real changes to production codebases
+ Pairs with engineers to solve complex problems and model best practices in architecture, code quality, and ...
Ready to Apply?
Submit your application today and join our talented team at JPMorgan Chase.
Submit ApplicationJob Details
- Location Chicago, IL
- Job Type Full-time
- Category other-general
- Posted Date June 25, 2026
- Application Deadline July 02, 2026