Lead Principal Engineer Package Technology Development

Your Role Key responsibilities in your new role: Drive
Micro Electro-Mechanical Systems
(MEMS) Package Technology Development
at Infineon, from
concept
to
high-volume ramp-up
. Act as the
lead engineer
and primary point of contact for direct communication with Infineon's key customers regarding
MEMS package technology
. Perform
process development activities
(including parameter scouting, optimization, verification, and process freeze) within development projects to achieve targets related to
timeline, quality, cost competitiveness, and manufacturability
. Define and drive technical specifications (BOM, package design, assembly process) for MEMS package projects involving major changes, risks, or new introductions. Lead a
global team
of process development engineers to successfully execute multiple
MEMS package NPI (New Product Introduction)
projects. Share your technical expertise and foster professional growth within your team....

Ready to Apply?

Submit your application today and join our talented team at infineon technologies asia pacific pte ltd.

Submit Application