Job Description
1. 熟悉相关站点流程，以下一种或者多种
1.1 die bonding, wire bonding；
1.2 wafer mount, wafer sawing；
1.3 molding, trim&form；
1.4 MOSFET final test及打标
2. 熟悉相关站点机器操作（东京精密，ASMPT，Disco，K&S，TOWA等）
3. 熟悉相关材料及tooling
4. 处理生产异常，改善制程以提升良率及降低成本
5. 配合客户audit
6. 制定及维护作业规范
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Submit ApplicationJob Details
- Location Jiangmen, Guangdong
- Job Type Full-time
- Category Other-General
- Posted Date May 26, 2026
- Application Deadline July 05, 2026