Job Description
**Job Description Summary**
As a Lead Embedded Engineer (LPB1), you will be a technical cornerstone in the development and evolution of the MarkVIe control platform. Operating within a global, cross-functional environment, you will drive the design, implementation, and optimization of firmware for our state-of-the-art power generation control systems. You will provide technical leadership, mentorship, and architectural guidance to ensure the reliability and performance of our embedded software.
**Job Description**
**Roles and Responsibilities**
+ **Technical Leadership:** Translate high-level system requirements into robust firmware architectures and low-level design specifications.
+ **Full-Cycle Development:** Lead the design, coding, testing, and debugging of mission-critical system software for the MarkVIe platform.
+ **Performance Optimization:** Analyze and enhance the efficiency, stability, and scalability of system resources to meet str...
As a Lead Embedded Engineer (LPB1), you will be a technical cornerstone in the development and evolution of the MarkVIe control platform. Operating within a global, cross-functional environment, you will drive the design, implementation, and optimization of firmware for our state-of-the-art power generation control systems. You will provide technical leadership, mentorship, and architectural guidance to ensure the reliability and performance of our embedded software.
**Job Description**
**Roles and Responsibilities**
+ **Technical Leadership:** Translate high-level system requirements into robust firmware architectures and low-level design specifications.
+ **Full-Cycle Development:** Lead the design, coding, testing, and debugging of mission-critical system software for the MarkVIe platform.
+ **Performance Optimization:** Analyze and enhance the efficiency, stability, and scalability of system resources to meet str...
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Submit ApplicationJob Details
- Location Hyderabad, India
- Job Type Full-time
- Category other-general
- Posted Date July 25, 2026
- Application Deadline July 30, 2026