Junior Packaging Engineer: Design, Test & Scale Solutions

Western Digital Capital

📍 bayan lepas, penang, Malaysia 💼 Full-time 🕒 Posted June 30, 2026

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Job Description

Western Digital Capital, located in Bayan Lepas, Malaysia, is seeking a Junior Packaging Engineer. This entry-level role is perfect for fresh graduates or early-career engineers who are eager to build their expertise in packaging design and testing. 
You will closely work with Senior Packaging Engineers, gaining valuable hands-on experience. Responsibilities include assisting in packaging design, conducting tests, and supporting NPI packaging activities. 
Join WD to contribute to innovative solutions in the AI-driven data economy. 
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Job Details

Location bayan lepas, penang
Job Type Full-time
Category Engineering
Posted Date June 30, 2026
Application Deadline August 09, 2026