Intern- Backend Assembly Ball Attach Equipment

Overview

Project Title: Ball Attach MTBA Improvement (Aurigin / ZenVoce). Support systematic MTBA improvement for Ball Attach equipment platforms by identifying top assist contributors, driving data‑driven root cause consolidation, and tracking sustained improvement actions. The project directly supports MMY’s SBP OEE and MTBA improvement strategy to strengthen manufacturing efficiency and stability.

Scope

• Identify and analyze top MTBA detractors: alarms, assists, minor stops
• Track MTBA trends by machine, platform, and time (pre‑ and post‑improvement)
• Consolidate recurring alarms and assists into a simple Pareto tree
• Support data‑driven root cause analysis and action definition
• Track action items: owner, status, closure and effectiveness
• Assist in before/after result validation using existing dashboards
• Prepare slide‑ready weekly updates for Equipment Engineering and management review

Ready to Apply?

Submit your application today and join our talented team at 1480 Micron Semiconductor Mala.