Intern, Assembly Equipment Engineer — WB NSOP Alarm Enhancement

Micron Technology, Inc

📍 simpang ampat, penang, Malaysia 💼 Full-time 🕒 Posted June 30, 2026

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Job Description

Micron Technology, Inc in Penang, Malaysia, is seeking an engineer to enhance NSOP (Non-Stick On Pad) alarm capabilities for early detection in the Wire Bond process. The role involves defining failure criteria and improving alarm logic to prevent production downtime. 
Candidates should have a background in Electrical, Manufacturing, or Mechatronics Engineering. The position offers opportunities to collaborate with various engineering teams and make significant contributions to process improvements. 
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Job Details

Location simpang ampat, penang
Job Type Full-time
Category Engineering
Posted Date June 30, 2026
Application Deadline August 09, 2026