Intern - Assembly Equipment Engineer

Project Title

Improvement of NSOP (Non‑Stick On Pad) Alarm for WB Process Early Detection

Description

Enhance NSOP (Non‑Stick On Pad) detection and alarm capability in the Wire Bond (WB) process to enable early identification of bond stick failure, reduce unscheduled downtime, and prevent extended production impact due to delayed NSOP response.

Scope

• Define and standardize NSOP (Non‑Stick On Pad) failure criteria in WB process
• Improve NSOP alarm logic for early detection before mass failure occurs
• Collaborate with EE and Manufacturing Engineers to align alarm thresholds with actual bonding behavior
• Execute UAT and pilot run on selected WB machines after alarm enhancement
• Collect NSOP event data for downtime, frequency, and failure trend analysis

Supporting Team

• Equipment Engineering (EE) Team
• Manufacturing Engineering Team
• Process Engineering Team
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