Description and Requirements
Key Responsibilities
Interconnect Solution Development
Develop and support interconnect solutions for AI servers, GPU, rack-level, and cluster-level platforms.Define cable and connector requirements based on system architecture, SI requirements, power delivery, thermal, and mechanical (and manufacturability) constraints.Support advanced interconnect applications, including:High-speed copper and optical interconnectsPatch panelsOptical cable assembliesCable cartridge solutionsInter-rack DC link high-power connectivityCollaborate with SL, EE, SI, ME, Thermal, and System teams (and Manufacturing) to ensure robust (and scalable) interconnect architecture integration.High-Speed Interconnect Technology
Support high-speed interconnection technologies, including (400G / 800G) interconnect solutions and future high-bandwidth AI infrastructure connectivity solutions.
Ready to Apply?
Submit your application today and join our talented team at Lenovo.
Submit Application