IC Power, IR and EM Principal Application Engineer
Cadence Design Systems, Inc.
Job Description
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
At Cadence, you have the opportunity to work with the dynamic and tenacious team solving some of the most complicated challenges in chip power integrity and thermal analysis. We are looking for people that are willing to push the boundaries of innovation to deliver highest quality solutions to our customers.
If tenacity, passion to innovate, determination to collaborate effectively, and win as a team are the attributes that define you, then you have a home in our team solving Power Integrity problems.
Ideal candidate should have:
+ Strong ability to solve electrical and electronic circuits.
+ Excellent knowledge on how power, IR, and EM analyses impact chip planning to IR/EM sign-off.
+ Fundamental understanding of interconnect modeling, package analysis, and die modeling.
+ Ability to write and debug automation code in Python or Tcl.
...
At Cadence, you have the opportunity to work with the dynamic and tenacious team solving some of the most complicated challenges in chip power integrity and thermal analysis. We are looking for people that are willing to push the boundaries of innovation to deliver highest quality solutions to our customers.
If tenacity, passion to innovate, determination to collaborate effectively, and win as a team are the attributes that define you, then you have a home in our team solving Power Integrity problems.
Ideal candidate should have:
+ Strong ability to solve electrical and electronic circuits.
+ Excellent knowledge on how power, IR, and EM analyses impact chip planning to IR/EM sign-off.
+ Fundamental understanding of interconnect modeling, package analysis, and die modeling.
+ Ability to write and debug automation code in Python or Tcl.
...
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Submit ApplicationJob Details
- Location Austin, TX
- Job Type Full-time
- Category other-general
- Posted Date June 27, 2026
- Application Deadline July 02, 2026