IC Packaging Method Engineer (1-Year Contract)

Nexperia
📍 seremban, negeri sembilan, Malaysia 💼 Full-time 🕒 Posted June 07, 2026

Job Description

Nexperia is looking for an Application Engineer in Seremban, Malaysia. This role focuses on developing packing methods and ensuring product quality throughout the development process according to EIA/IEC Standards.

The ideal candidate will have a degree in Engineering or Materials Science, knowledge of IC package design, and strong problem-solving skills. Experience with Design FMEA and CAD is essential.

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Job Details

  • Location seremban, negeri sembilan
  • Job Type Full-time
  • Category IT & Technology
  • Posted Date June 07, 2026
  • Application Deadline July 17, 2026