IC Package Design / Development

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Job Description:

IC Package Design / Development

Role Overview

We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and productization using advanced node silicon (7nm, 5nm, 3nm and beyond). This role partners closely with chip design, system design, SI/PI, thermal, and manufacturing teams to define and deliver industry-leading package solutions. The ideal candidate has deep technical expertise in substrate design, floor-planning, bump architecture, advanced materials, and HVM execution.

Key Responsibilities

Package Architecture, Co-Design & Optimization

Ready to Apply?

Submit your application today and join our talented team at Broadcom Inc..