Job Description
Intel Corporation in Penang is seeking a Silicon Packaging Design Engineer to lead the development of substrate designs. This role involves optimizing silicon-package-board interfaces and contributes to critical advancements in semiconductor technology.
The ideal candidate holds a Bachelor's degree in a relevant field and has at least 4 years of relevant experience. Proficiency in Cadence APD or Mentor Xpedition is essential. Join Intel to take the next step in your engineering career in a hybrid work environment.
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Submit ApplicationJob Details
- Location seberang perai, penang
- Job Type Full-time
- Category Engineering
- Posted Date July 05, 2026
- Application Deadline August 14, 2026