Job Description
About Our Client
A global leader with over seventy years of engineering expertise, this company specializes in equipment and process solutions for microstructuring applications
Its comprehensive portfolio includes products and solutions for backend lithography, wafer bonding, and photomask processing, along with a range of micro-optical components
Their technologies are integral to the production of memory chips, mobile phone cameras, tire pressure sensors, and other devices used in both everyday and industrial applications.
Customers across the semiconductor industry and adjacent markets such as Advanced Packaging, MEMS, and LED sectors value the company's extensive experience in wafer processing, making it a trusted partner for both high-volume manufacturing and research and development initiatives.
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Submit ApplicationJob Details
- Location Taiwan, Hsinchu City
- Job Type Permanent
- Category Operations Specialties Managers
- Posted Date March 02, 2026
- Application Deadline April 11, 2026