Graduate Process Engineer

Renesas Electronics

📍 Bayan Lepas, Penang, Malaysia 💼 Full-time 🕒 Posted February 28, 2026

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Job Description

Job Description
As a Die Bond & Wire Bond Engineer, you will be part of a dynamic manufacturing team, supporting semiconductor assembly processes from development to mass production. This role is ideal for fresh graduates who are eager to learn, hands-on, and passionate about process improvement.
Support the development, optimization, and maintenance of die bond and wire bond processes to ensure good quality, yield, and reliability
Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment-related problems
Participate in new product introduction (NPI), process qualification, and transition to mass production
Help establish and update process parameters, work instructions, and control plans
Analyze process data using basic statistical tools such as SPC, CPK, and trend analysis
Work closely with cross-functional teams including Production, Quality, Equipment, and R&D
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Job Details

Location Bayan Lepas, Penang
Job Type Full-time
Category Engineers
Posted Date February 28, 2026
Application Deadline April 09, 2026