Foveros Direct Pathfinding Integration

Intel
📍 Hillsboro, OR, United States 💼 Full-time 🕒 Posted June 08, 2026

Job Description

**Job Details:**

**Job Description:**

Discover how your skills and expertise can have a lasting impact on Intel's industry-leading innovations. Apply today to become part of the team shaping the future of semiconductor packaging technology.

Some of the responsibilities will include but not be limited to:

+ You will apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all types of products.
+ Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking. Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packag...

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Job Details

  • Location Hillsboro, OR
  • Job Type Full-time
  • Category other-general
  • Posted Date June 08, 2026
  • Application Deadline June 13, 2026