Failure Analysis Engineer

Failure Analysis (FA) Engineer - PCBA
Role Overview:
The Failure Analysis Engineer is responsible for performing root-cause analysis on defective or failed printed circuit board assemblies (PCBAs). By using destructive and non-destructive testing techniques—specifically Dye & Pry and Cross-Section Analysis—the engineer identifies physical defects and translates findings into actionable improvements in manufacturing and design.
Key Responsibilities:
Failure Analysis Execution: Perform Dye & Pry testing on suspect SMT and BGA components to verify solder joint integrity, detect fatigue cracks, pad cratering, and open circuits.
Cross-Sectioning: Prepare, mount, grind, and polish PCBA samples to analyze internal layer structures, plated through-holes (PTH), intermetallic compounds (IMC), and layer thicknesses.
Microscopy & Imaging: Utilize optical microscopes and Scanning Electron Microscopes (SEM) to inspect, document, and measure defects found during testing.
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