Job Description
**Job Summary:**
· New Package Technology and New Platform Module Development
o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
o Good understanding of MRS and generate PRS with SCD definition.
o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
o Familiar with DFM, to secure robust manufacturability with quality requirements.
o Good understanding of power module package design rule, design rule update with new platform development.
o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.).
o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
o Drive problem ...
· New Package Technology and New Platform Module Development
o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
o Good understanding of MRS and generate PRS with SCD definition.
o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
o Familiar with DFM, to secure robust manufacturability with quality requirements.
o Good understanding of power module package design rule, design rule update with new platform development.
o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.).
o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
o Drive problem ...
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Submit ApplicationJob Details
- Location Seremban, Malaysia
- Job Type Full-time
- Category other-general
- Posted Date June 15, 2026
- Application Deadline June 20, 2026