ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)

Onsemi

📍 Seremban, Negeri Sembilan, Malaysia 💼 Full time 🕒 Posted June 07, 2026

Apply Now Similar Jobs

Job Description

onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.
Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
Conducts DFM (Design for Manufacturability) reviews with a focus on solder/ wire joint integrity and thermal prof...
            

Ready to Apply?

Submit your application today and join our talented team at Onsemi.

Submit Application

Job Details

Location Seremban, Negeri Sembilan
Job Type Full time
Category Engineers
Posted Date June 07, 2026
Application Deadline July 17, 2026