Engr Prin, Package Development (NPI Mold Engineer)

onsemi
📍 seremban, negeri sembilan, Malaysia 💼 Full-time 🕒 Posted June 07, 2026

Job Description

Job Summary

Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. Key person responsible to align processes between R&D and Manufacturing. Establish process POR through setup, feasibility and characterization followed by package development procedure.

Responsibilities

  • End of Line process development and enabling technology for molded package.
  • Capable to understand the design and proposal for improvement from End of Line process.
  • Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
  • Familiar with EMC materials.
  • Capability to define KPIV from failures modes.
  • Capability to define KPOV and generate output by analyzing process capability.
  • Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
  • Effectively working with technical leaders to generate process deliverables (Control Pla...

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Job Details

  • Location seremban, negeri sembilan
  • Job Type Full-time
  • Category IT & Technology
  • Posted Date June 07, 2026
  • Application Deadline July 17, 2026