ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

1100 Micron SemiAsiaOP Pte Ltd
📍 singapore, singapore, Singapore 💼 Full-time 🕒 Posted July 08, 2026

Job Description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Engineer Package–Silicon Integration As an Engineer, Package–Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will begin your career as a technical contributor supporting NAND package and silicon integration for next‑generation memory products. In this role, you will work closely with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams to learn Micron’s technology development processes, contribu...

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Job Details

  • Location singapore, singapore
  • Job Type Full-time
  • Category Other-General
  • Posted Date July 08, 2026
  • Application Deadline August 17, 2026