Engineer I - Process (Photolithography)

Responsibilities

The Junior Engineer – Photolithography is responsible for supporting process development, control, and optimization of photolithography processes in Panel Level Packaging (PLP) and Wafer Level Chip Scale Packaging (WLCSP). The role ensures stable patterning performance, defect reduction, and high yield through strong process monitoring and data-driven improvements.

• Support end-to-end photolithography processes including; Coat, Expose and Develop process using tools like ACM and Delta tools, Pattern Lamination, Expose and Develop process, After Develop Inspection (ADI) and CD metrology
• Monitor and control critical parameters; Resist thickness uniformity, Critical Dimension (CD), Overlay / alignment accuracy and Defects (particles, scum, residues, lifting)
• Drive defect reduction and cycle time improvement projects
• Perform routine data analysis and trend monitoring
• Support root cause analysis (RCA) and ...

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