Early‑Career Package–Silicon Integration Engineer

Dormont Manufacturing Co

📍 singapore, singapore, Singapore 💼 Full-time 🕒 Posted June 30, 2026

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Job Description

Dormont Manufacturing Co is seeking an Engineer in Package–Silicon Integration based in Singapore. This early-career position allows you to support NAND package and silicon integration for next-generation memory products under guidance. 
Your responsibilities will include assisting in chip-package interaction assessments, participating in DFMEA/PFMEA activities, and collaborating with various engineering teams. Candidates should have a Bachelor’s or Master’s in Engineering and a basic understanding of semiconductor manufacturing. 
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Job Details

Location singapore, singapore
Job Type Full-time
Category Other-General
Posted Date June 30, 2026
Application Deadline August 09, 2026