Director, Package Quality and Reliability

The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM). This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC.

• Package Quality & Reliability Engineering
  • Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing
  • Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo‑mechanical stress, and material‑related failure mechanisms
  • Drive improvements in reliability test ...

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