Direct Lid/Stiffener Attach Packaging Module Development Engineer

Intel Corporation
📍 kulim, kedah, Malaysia 💼 Full-time 🕒 Posted June 07, 2026

Job Description

Package Module Development Engineer – Package Module Development

Responsibilities:

  • Define and establish process flow, conduct FMEA assessment, review procedures and drawings, and configure equipment for NPI products.
  • Select and develop materials and equipment (recipes, collaterals) based on design rules, driving improvements to meet quality, reliability, cost, yield, productivity, and manufacturability requirements across variables such as material, method, equipment, environment, and personnel.
  • Plan and conduct experiments to fully characterize the process throughout the development cycle.
  • Develop solutions to problems utilizing formal education, statistical knowledge, and problem‑solving tools.
  • Participate in pathfinding activities including new TIM (thermal interface material) qualification related to thermal performance, and new failure‑mode characterization and resolution.
  • Establish process control systems for...

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Job Details

  • Location kulim, kedah
  • Job Type Full-time
  • Category Engineering
  • Posted Date June 07, 2026
  • Application Deadline July 17, 2026