Die Attach & Wire Bond Process Engineer – Yield-Focused

Coherent Corp.
📍 ipoh, perak, Malaysia 💼 Full-time 🕒 Posted June 20, 2026

Job Description

Coherent Corp. is seeking a skilled professional to improve the Die Attach & Wire Bond Process. Responsibilities include analyzing processes, resolving issues, and implementing engineering reports in the electronics manufacturing sector.

The candidate needs a Bachelor of Science in Engineering, preferably in Electronics. Responsibilities also include developing work instructions and adhering to company values like integrity and collaboration. The role requires 100% onsite presence in Ipoh, Malaysia.

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Job Details

  • Location ipoh, perak
  • Job Type Full-time
  • Category Engineering
  • Posted Date June 20, 2026
  • Application Deadline July 30, 2026