Job Description
Job Description1. Familiar to 2.5D or 3D PKG integration & development & mass production experience
2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal considerationRequirement1. Understanding TSMC, INTEL, OSAT 2.5D PKG technology
2. Understand TSMC, INTEL 3D PKG technology
3. Experience on chiplet architecture with integration flow
2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal considerationRequirement1. Understanding TSMC, INTEL, OSAT 2.5D PKG technology
2. Understand TSMC, INTEL 3D PKG technology
3. Experience on chiplet architecture with integration flow
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Submit ApplicationJob Details
- Location Hsinchu City, Taiwan Province
- Job Type Full-time
- Category Engineers
- Posted Date March 02, 2026
- Application Deadline April 11, 2026