Job Description
**OVERVIEW:**
The APAC Data Center Physical Provisioning (DCPP) discipline is responsible for managing and tracking of all activity within the current and future-processing environment in the data centers. This functional group, in conjunction, with the DCSD monitors all BAU and projects’ including hardware installs and upgrades, as well as breaks / fixes trouble related activity. It also assures the proper and timely coordination and escalation of all processing problems along with documentation on a daily basis.
This discipline acts as the managing interface to Real Estate Services (RES). DCPP coordinates RES activities within the facility and is ultimately responsible for the management and control of the data center raised floor. DCPP is responsible for the receipt, placement, and installation of hardware on the processing floor. They must ensure compliance and enforce all rules and standards, by assuming an active lead role, in the change control process.
**...
The APAC Data Center Physical Provisioning (DCPP) discipline is responsible for managing and tracking of all activity within the current and future-processing environment in the data centers. This functional group, in conjunction, with the DCSD monitors all BAU and projects’ including hardware installs and upgrades, as well as breaks / fixes trouble related activity. It also assures the proper and timely coordination and escalation of all processing problems along with documentation on a daily basis.
This discipline acts as the managing interface to Real Estate Services (RES). DCPP coordinates RES activities within the facility and is ultimately responsible for the management and control of the data center raised floor. DCPP is responsible for the receipt, placement, and installation of hardware on the processing floor. They must ensure compliance and enforce all rules and standards, by assuming an active lead role, in the change control process.
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- Location Yokohama, Japan
- Job Type Full-time
- Category other-general
- Posted Date June 02, 2026
- Application Deadline June 08, 2026