ASIC Package Engineer

**Meet the Team**

We are seeking a skilled and driven ASIC Mechanical Engineer to join Cisco ASIC Group. In this role, you will focus on mechanical and thermomechanical simulations of ASICs and complex silicon packages. Your simulations will directly facilitate product design, ensure mechanical reliability, and accelerate time to market for high-performance Cisco systems.

You will collaborate with a globally distributed team across multiple time zones, contributing to innovative, simulation-driven design across packaging, reliability, thermal, and hardware engineering groups.

**Your Impact**

· Perform finite element analysis to evaluate thermal mechanical stress, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies.

· Simulate and analyze linear/nonlinear material behaviors, such as plasticity, creep, and viscoelasticity, relevant to solder joints, Copper, stiffener, and underfills.
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Ready to Apply?

Submit your application today and join our talented team at Cisco.

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