Job Description
Tampereen Yliopisto is looking for up to three Process Engineers specializing in semiconductor packaging processes in Tampere, Finland. This role involves developing processes like flip-chip bonding, dicing, and grinding, contributing to customer projects across academia and industry.
Ideal candidates hold an M.Sc. or Ph.D. in relevant fields with at least three years of experience. Successful applicants will enjoy competitive benefits including flexible work schedules and occupational healthcare services.
#J-18808-LjbffrReady to Apply?
Submit your application today and join our talented team at Tampereen Yliopisto.
Submit ApplicationJob Details
- Location tampere, manner suomi
- Job Type Full-time
- Category Plastics & Process Engineering
- Posted Date July 02, 2026
- Application Deadline August 11, 2026