Job Description
Job Description1. Advanced process technology development
2. Advanced package technology developmentRequirementExperience in research and development of advanced 3nm/2nm process technology
Development of advanced yield improvement and failure analysis techniques (IP test chip trial production, DRC inspection, failure diagnosis analysis, material analysis)
Development of advanced new product introduction technology (new product trial production planning, DRC inspection, DOE and yield improvement planning, mass production interval and yield analysis)
More than 4 years of work experience in a semiconductor foundry
2. Advanced package technology developmentRequirementExperience in research and development of advanced 3nm/2nm process technology
Development of advanced yield improvement and failure analysis techniques (IP test chip trial production, DRC inspection, failure diagnosis analysis, material analysis)
Development of advanced new product introduction technology (new product trial production planning, DRC inspection, DOE and yield improvement planning, mass production interval and yield analysis)
More than 4 years of work experience in a semiconductor foundry
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Submit ApplicationJob Details
- Location Hsinchu City, Taiwan Province
- Job Type Full-time
- Category Engineers
- Posted Date February 25, 2026
- Application Deadline April 06, 2026