Job Description
Job DescriptionAdvanced packaging technology development
#LI-ML2
1. Advanced new product introduction technology development (new product trial production planning, DRC inspection, DOE and yield improvement planning, mass production interval and yield analysis)
2. Familiar with advanced chiplet and 3DIC packaging technology development
3. Advanced packaging structure design at wafer level and panel levelRequirement1. Have practical experience in Layout/process/reliability
2. Simulation analysis of mechanical properties and thermal properties
3. Experience in large packaging and memory development
4. Development experience in common optical packaging technology
5. PI/SI application analysis experience
6. More than 8 years of working experience in foundry or related advanced packaging
#LI-ML2
1. Advanced new product introduction technology development (new product trial production planning, DRC inspection, DOE and yield improvement planning, mass production interval and yield analysis)
2. Familiar with advanced chiplet and 3DIC packaging technology development
3. Advanced packaging structure design at wafer level and panel levelRequirement1. Have practical experience in Layout/process/reliability
2. Simulation analysis of mechanical properties and thermal properties
3. Experience in large packaging and memory development
4. Development experience in common optical packaging technology
5. PI/SI application analysis experience
6. More than 8 years of working experience in foundry or related advanced packaging
Ready to Apply?
Submit your application today and join our talented team at MediaTek.
Submit ApplicationJob Details
- Location Hsinchu City, Taiwan Province
- Job Type Full-time
- Category Operations Specialties Managers
- Posted Date February 24, 2026
- Application Deadline April 05, 2026