ADVANCED PACKAGING TD - Principal Engineer, Process Integration

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As principal process integration engineer who work on HBM product.

Expectation is to lead cross-site/country project to ensure HBM technology roadmap milestone is met

Need to be familiar with skillset/knowledge as below:
1. DRAM process/structure

2. HBM process/structure

3. Model based problem solving skill

4. Inline defect/electrical yield data mining skill

5. DRAM/PKG test structure/program

6. Reliability test flow/condition, fail mechanism.

7. PKG layout design rule

Software skill requirement:

1. JMP

2. Yield cube 3

3. MobaXterm

4. Klarity

5. Klayout

6. SPC

Ready to Apply?

Submit your application today and join our talented team at Micron.