Advanced Packaging & Power Delivery Senior Engineer

Position Overview

As a Senior Advanced Packaging & Power Delivery Engineer at Axelera AI, you will play a pivotal role in shaping the silicon and packaging architecture of next‑generation AI accelerators. You will own power‑delivery design across the full stack – from on‑die power grids to package and PCB PDN – and bring deep expertise in advanced packaging technologies to help us scale from today’s products to tomorrow’s multi‑chiplet, 3D‑integrated systems.

Working within our R&D Custom Design team and collaborating closely with Silicon Engineering and AI Integrated Systems, you will be at the intersection of analog design, packaging innovation, and product delivery – with real ownership and direct impact on the chips we ship.

Key Responsibilities

• Own power‑delivery design end to end, from on‑die power grids to package and PCB PDN design and analysis.
• Lead advanced packaging architecture decisions for 2.5D/3D stacking, multi‑c...

Ready to Apply?

Submit your application today and join our talented team at Axelera AI.